ChipInsight enables use of actual wafer print contours created from arrays of high-resolution CD-SEM images, stitched together into XFOV (Extended Field of View) Images. Actual wafer print contours, not models, are the litmus test for OPC performance evaluation.
ChipInsight can create XFOV images of essentially any size. ChipInsight extracts contours from these XFOV images and then overlays the design target. ChipInsight then finds, marks, classifies and ranks differences between the design and the actual wafer print results and outputs the contours and differences in standard file formats.
Validation using XFOV contours can be performed for a single layer or multiple layers. XFOV contours can be generated at any/many threshold levels.
ChipInsight ranks and marks differences found between design and wafer print with searchable markers.
The XFOV contours, differences, and markers are output as separate GDSII files. Difference data is output as a csv file.
BenefitsChipInsight finds and reports actual differences between wafer print and design, identifying hotspots missed by simulation/model-based OPC tools.
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ChipInsight can find and evaluate differences between contours and design It can identify matching issues on single layer or between layers.System will mark the critical sites (hotspots) with searchable markers.
Contours and Markers can be downloaded as GDS files for upload into OPC system. | 
