ChipInsight is a powerful wafer print contour analysis and design verification/validation system complementing today's model-based design and OPC tools. ChipInsight generates a single Extended Field of View (XFOV) image from large arrays of CD-SEM images and delivers seemless 2D contours, enabling validation and verification over large areas using actual wafer prints. ChipInsight is a step forward for customers relying on OPC simulation and traditional CD validation. ChipInsight also addresses a number of issues of traditional one-dimensional SEM metrology approaches. Simulation is absolutely necessary in the design/opc cycle, but it is insufficient to verify and validate designs and OPC models for advanced technology products. ChipInsight closes the verification and validation loop, quickly and completely, using high resolution images from actual wafer prints. Because it uses actual wafer print images, ChipInsight is the perfect complement to existing model-based OPC tools. ChipInsight functions as the "litmus test" for today’s tools. ChipInsight provides the ultimate in reliable, and comprehensive, design and OPC/RET validation and verification data; using actual wafer contour results, across all features, on all critical modules, with the computing power to process images taken over the entire chip. ChipInsight is a high-performance, server-based image analysis product that uses proprietary technology to assemble top-down CD-SEM images seamlessly into XFOV images, extract contours reliably and then analyze the differences between the contours and the design intent. The ChipInsight product is designed to address a number of industry issues encountered using standard, simulation-only approaches. Read more about applications Industry issues addressed:
Core functions:
Product Demo To get access to product demo complete request here. or contact us at semi@simagis.us to arrange an on-line demonstration
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ChipInsight Overview |